EU Pilot Line To Open Bids For New Chip Projects
The FAMES Pilot Line, a new European chip R&D center, is now accepting proposals for potential projects, such as FD-SOI devices and others.
By Mark LaPedus
The FAMES Pilot Line, a new European chip R&D center, is now accepting proposals for potential projects in various areas within the semiconductor industry.
Launched in 2024, the FAMES Pilot Line can be used for the development and testing of five kinds of technologies: FD-SOI at 10nm and 7nm; embedded non-volatile memories; RF components; 3D integration technologies; and small inductors to develop DC-DC converters for power-management integrated circuits (PMICs).
France’s CEA-Leti is the coordinator of the program. Now, the FAMES Pilot Line launched its first open access call, which enables entities to submit proposals and projects at the center.
Design houses, fabless companies, foundries, integrated device manufacturers, material and tool suppliers, universities and research centers can submit user requests by responding to the two-month-long open-access call, starting on March 18, or by submitting a “Spontaneous User Request” throughout the year.
The Open Access Committee, representing the consortium’s 11 partners, will review and select applicants’ proposals. Pricing will depend on the specifics of each R&D project.
“It is essential that these new technologies can be adopted by EU chip stakeholders. For that reason, FAMES has been strategically structured to leverage them, in order to support all sectors of the EU’s semiconductor value chain,” said Sébastien Dauvé, chief executive of CEA-Leti.
Participants whose requests are selected will have access to FAMES technologies as they become available. The open access calls will take place each spring through 2028, with an updated portfolio of available FAMES technologies.
Users of the pilot line will have access to:
*Two types of PDKs. Pathfinding PDKs for FD-SOI advanced-node performance evaluation. And PDKs giving access to silicon, via multi-project wafers (MPW).
*Specific process steps, modules, integration flows, and demonstrator results.
*Education and training on FAMES technologies.
The pilot line envisions new market opportunities for low-power microcontrollers (MCUs), multi-processor units (MPUs), AI and machine-learning devices, smart data-fusion processors, RF devices, chips for 5G/6G, chips for automotive markets, smart sensors & imagers, trusted chips, and new space components.