Intel Unveils Processors Build Around New 18A Process
The chips are designed for the mobile market, enabling the next wave of AI-based notebook PCs
By Mark LaPedus
At CES in Las Vegas, Intel has launched its Core Ultra Series 3 processor line, marking the debut of the company’s first chips built on its new 18A process technology.
Intel’s processors, codenamed Panther Lake, have been expected for some time. The processors are designed for the mobile market, enabling the next wave of AI-based notebook PCs.
Designed and manufactured by the most advanced process node in the United States, these new chips aim to redefine computing for both consumers and businesses, offering enhanced performance, battery life and advanced graphics capabilities.
Intel’s 18A process is a 2nm-class technology. It combines a gate-all-around (GAA) transistor architecture with a backside power delivery technology. Intel refers to its GAA transistor technology as the RibbonFET. Intel refers to its backside power delivery technology as the PowerVia.
The 18A process is optimized for the company’s own chips. Intel is also pushing 18A for the foundry market, but the company is struggling on this front. Samsung and TSMC are also ramping up their respective 2nm processes for the foundry market.
Meanwhile, Intel’s new processors incorporate the company’s integrated Arc graphics. They are purpose-built for multitaskers that handle advanced workloads like gaming, creation and productivity.
The top SKUs feature up to 16 CPU cores, 12 Xe cores and 50 NPU TOPS, delivering up to 60% better multithread performance, over 77% faster gaming performance, and up to 27 hours of battery life.
Intel’s Core Ultra Series 3 delivers competitive advantages in critical edge AI workloads with up to 1.9x higher large language model (LLM) performance, up to 2.3x better performance per watt per dollar on end-to-end video analytics, and up to 4.5x higher throughput on vision language action (VLA) models
Pre-orders for the first consumer laptops powered by Intel Core Ultra Series 3 processors will begin Jan. 6, 2026. Systems will be available globally starting Jan. 27, 2026, with additional designs coming throughout the first half of the year.