Mitsubishi, Rohm, Toshiba To Merge Power Semi Businesses
The eventual goal is to form a new company that would develop and sell power devices and semiconductors in the market
By Mark LaPedus
Mitsubishi, Rohm and Toshiba Electronic Devices & Storage are in discussions to merge their power device and semiconductor businesses.
A memorandum of understanding (MOU) has been signed between Mitsubishi Electric, Rohm and Toshiba, along with Japan Industrial Partners (JIP) and TBJ Holdings.
The eventual goal is to form a new company that would develop and sell power devices and semiconductors in the market. The combined entity would likely sell silicon-based power semiconductors, gallium nitride (GaN) devices and silicon carbide (SiC) MOSFETs.
Amid fierce competition in the market, Toshiba and Rohm for some time have been looking at new and different ways to collaborate in the power device business.
In 2023, the two companies jointly submitted a plan to Japan’s Ministry of Economy, Trade and Industry, covering a collaborative effort in the power device market. The idea was to ensure a secure and stable supply of power semiconductors and other products in Japan.
More recently, Toshiba, JIP, TBJ, Rohm and Mitsubishi Electric have entered into new discussions. Under a proposed plan, Mitsubishi, Rohm and Toshiba would integrate their power device and semiconductor businesses.
This agreement marks the commencement of deliberations. At this stage, no decisions have been made regarding transaction terms or the specific details of the business integration.
Toshiba Electronic Devices & Storage Corp. (TDSC), a subsidiary of Japan’s Toshiba, develops and sells MCUs, power management ICs, power semiconductors and other products.
Japan’s Mitsubishi Electric’s power device unit sells driver ICs, power semis, silicon carbide (SiC) MOSFETs and other products.
Rohm makes and sells driver ICs, MCUs, power management ICs, power semiconductors, sensors and many other products.