TSMC, Amkor Form Packaging/Test Partnership
This establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services
By Mark LaPedus
TSMC and Amkor Technology have formed a major and long-term partnership in the advanced packaging and test arena in the United States.
The 10-year agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. The partnership centers around Arizona, where each company is separately developing a major manufacturing base.
Today, TSMC, the world’s largest foundry vendor, manufactures a large percentage of its chips in Taiwan. Then, in the U.S., TSMC is currently manufacturing advanced chips in its first fab in Arizona. The company is also building three more fabs in Arizona. Plus, TSMC plans to build an advanced packaging facility in the same location.
Meanwhile, Amkor, a large U.S.-based OSAT, is building a large-scale advanced packaging and test campus in Peoria, Ariz. In Arizona, Amkor is expected to manufacture advanced packages in early 2028. OSATs provide third-party packaging and testing services for the semiconductor industry.
In Arizona, TSMC and Amkor are in close proximity to each other. Peoria is a major suburb of Phoenix. TSMC’s fab site is located in Phoenix.
Nonetheless, TSMC and Amkor this week announced a major 10-year agreement. “This includes a structured approach for TSMC to procure advanced packaging and test services from Amkor, along with coordinated capacity expansion and planning,” according to officials from Amkor, based in Tempe, Ariz.
By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model while strengthening their ability to support customers’ evolving requirements.
“This agreement marks an important next step in our partnership with TSMC as we accelerate advanced semiconductor manufacturing in the U.S. to provide our customers a full U.S. supply chain from advanced silicon manufacturing to tested packaged devices,” said Kevin Engel, chief executive of Amkor.