Semiecosystem

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Micron To Invest $200 Billion in Fabs And R&D in U.S.
What are Micron’s fab plans in the United States? In addition, the company rolled out its first EUV-enabled DRAMs.
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Semiecosystem
TSMC Tops New Foundry Rankings, Samsung Loses Ground
Is China's SMIC ramping up a 5nm process?
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Semiecosystem
Taiwan’s Win Semiconductors Debuts 0.12μm GaN Foundry Process
The process is targeted for high-power applications across the K-Band to V-Band frequencies
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Semiecosystem
GlobalFoundries To Invest $16 Billion In Fabs & Packaging
The investments are in response to the explosive growth in AI, data centers and other markets.
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Semiecosystem
Mid-Year Forecasts: Chips, Phones, PCs, Data Centers, Robots
What’s ahead for the semiconductor, smartphone, PC and other markets for the second half of 2025 and beyond?
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Semiecosystem

May 2025

ASE Rolls Out High-End Package For AI Apps
Updated: The package makes use of a new, advanced silicon bridge technology. Amkor, Intel, Samsung, TSMC and others provide silicon bridges for…
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Semiecosystem
IBM To Bring Deca’s Fan-Out Packaging Technology To North America
What is IBM doing in packaging and who are they working with?
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Semiecosystem
AI Packaging, CPO, Hybrid Bonding Featured At ECTC
These are important technologies, but why do we need them?
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Semiecosystem
Taiwan Firm Boosts U.S. Silicon Wafer Industry
Updated: GlobalWafers is shipping the first wafers from its two new and advanced silicon wafer manufacturing plants in the U.S.
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Semiecosystem
TSMC To Sell Equipment To New Foundry JV
TSMC plans to sell some fab equipment to VSMC, a new 300mm foundry venture based in Singapore
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Semiecosystem
The Latest News In IC Packaging & Test
Update: SEMI's new board members; digital twins conference; Qualcomm buys Alphawave Semi; EU sustainability project; Micron’s 1γ (1-gamma) DRAM…
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Semiecosystem
ASE, Amkor Top OSAT Rankings But China Gains Ground
ASE and Amkor maintained their leading positions in the OSAT rankings in 2024, but vendors from China continue to gain ground
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Semiecosystem
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