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IBM Debuts Nanostack Technology For Sub-1nm Chips
Big Blue has unveiled a sub-1nm chip technology, featuring a new transistor architecture at the 0.7nm node
Jun 25
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China Takes Lead In Supercomputer Race
China’s LineShine supercomputer is now the world’s fastest system
Jun 25
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Teledyne Expands MEMS Foundry Unit
Teledyne MEMS is expanding its manufacturing operations in Canada
Jun 25
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Quantum Computing Acquires NHanced Semiconductors
Quantum Computing Inc., a quantum optics and photonics company, has acquired NHanced Semiconductors, a U.S-based advanced packaging vendor
Jun 23
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Nearfield Instruments Receives New Funding
The company is shipping a scanning probe microscopy system for nanometer-scale metrology
Jun 22
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AMD Acquires ‘Predictive Memory’ Startup
AMD acquired MEXT, a developer of AI-driven memory optimization technology
Jun 20
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Intel Names New Advanced Packaging Chief
Intel has reorganized its foundry unit, naming a new executive to lead its packaging business
Jun 18
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Materials Discovery Firm Receives $500M In Funding
SandboxAQ has received government funding to accelerate its technology
Jun 17
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Intel Foundry Describes New 18A-P Process
The 2nm-class process enables high-performance chips. It features a dual contact, low resistance transistor option
Jun 16
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Semiecosystem
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TSMC, Amkor Form Packaging/Test Partnership
This establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services
Jun 16
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TSMC Gains Foundry Share in Q1 ‘26
The company continues to lead the foundry market by a wide margin. Several other vendors lost share
Jun 12
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Foundryecosystem Report: Huawei, Terafab, EU, GF, AMAT
How will Huawei make 1.4nm chips? Plus: Terafab's fuzzy logic, EU Chips Act 2.0, GF deals, Applied expands, JCET goes 3D
Jun 11
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